Thermaltake Spedo Advance Chassis
Introduction
Published: 17th September 2008 | Source: Thermaltake | Price: £130.39 |
Introduction 
At Computex 2008, Taipei based chassis and aftermarket cooling manufacturers' Thermaltake exhibited their latest chassis - Spedo, which promised to revolutionise the global PC chassis market. Thermaltake' design criterion for the Thermaltake Spedo appears to be based primarily on providing a chassis that provides excellent thermal management properties and better cable routing. Let's see what Thermaltake has to say about their Thermaltake Spedo chassis:
Thermaltake as the top choice brand of PC Chassis around the world, will be exhibiting their latest innovation of the new Chassis Superlative --- SPEDO! With many new features that are never seen on the market before, SPEDO has been predicted to be the next hit of the global PC Chassis Market.
Thermaltake has implemented two breakthrough designs into the new SPEDO Chassis; “A.T.C.” (Advanced Thermal Chamber) and “CRM” (Cable Routing Management). While “ATC” design provides excellent thermal-management by separating chambers for the CPU, GPUs and PSU, “CRM” offers users a neat and tidy interior with superior cable arrangement. Not to mention the excellent integration of advanced tool-free mechanism for HDD and PCI installation; bottom-placed PSU design and the adjustable fan bar; SPEDO will provide the minimized and the most enjoyable system installation experience! The hot swap design of side fan and the adjustable fan bar allow easier system maintenance, VGA/ CPU thermal management can also be easily solved by simple adjustments of the fan bar to fit with various system requirements.
Other than the structural perfection internally, the meshed exterior design of SPEDO allows the ambient air to enter unrestrictedly into the chassis. Ventilation can even be further upgraded with up to nine system fans. With the C-shaped unique styling, SPEDO will bring you the most pleasure as a true PC enthusiast both from the experiential and functional perspectives.
Thermaltake has implemented two breakthrough designs into the new SPEDO Chassis; “A.T.C.” (Advanced Thermal Chamber) and “CRM” (Cable Routing Management). While “ATC” design provides excellent thermal-management by separating chambers for the CPU, GPUs and PSU, “CRM” offers users a neat and tidy interior with superior cable arrangement. Not to mention the excellent integration of advanced tool-free mechanism for HDD and PCI installation; bottom-placed PSU design and the adjustable fan bar; SPEDO will provide the minimized and the most enjoyable system installation experience! The hot swap design of side fan and the adjustable fan bar allow easier system maintenance, VGA/ CPU thermal management can also be easily solved by simple adjustments of the fan bar to fit with various system requirements.
Other than the structural perfection internally, the meshed exterior design of SPEDO allows the ambient air to enter unrestrictedly into the chassis. Ventilation can even be further upgraded with up to nine system fans. With the C-shaped unique styling, SPEDO will bring you the most pleasure as a true PC enthusiast both from the experiential and functional perspectives.
View the press release here.
While Thermaltake uses two acronyms to describe the predominant features of the Spedo - Advanced Thermal Chamber (A.T.C) and Cable Routing management (CRM), these technologies are hardly new. A.T.C in its very essence is compartmentation, or breaking the chassis down and isolating the main thermal emitting components of your PC in order to reduce overall case temperatures. Fellow Taipei chassis manufacturers' Lian Li have been using this technology for some time now.
CRM has also been doing the rounds quite a bit recently, with many chassis manufacturers' opting for different approaches to the problem. Cable routing holes in motherboard trays seem to be favourite here, but Thermaltake have actually taken it one step further. And no I'm not going to spoil the surprise, you're going to have to wait a bit longer. Unless of course you'd like to check out the teaser video that Thermaltake released!
It's been quite a while since we had a Thermaltake chassis in at OC3D, and now that the Thermaltake Spedo is finally here let's begin the review by taking a look at the all important specifications.
Specifications
VI90001W2Z
Model Name: Spedo Advance Package
Case Type: Full Tower
Dimensions (HxWxD): 536mmx232mmx610mm
Net Weight: 13.0 kg/ 28.7lb
Windows Side Panel: Transparent Window
Cable Routing Management: Yes
Advanced Thermal Chamber: Yes
Material Front bezel: Matal Mesh/ Chassis: 0.8mm SECC
Colour Exterior and Interior: Black
Model Name: Spedo Advance Package
Case Type: Full Tower
Dimensions (HxWxD): 536mmx232mmx610mm
Net Weight: 13.0 kg/ 28.7lb
Windows Side Panel: Transparent Window
Cable Routing Management: Yes
Advanced Thermal Chamber: Yes
Material Front bezel: Matal Mesh/ Chassis: 0.8mm SECC
Colour Exterior and Interior: Black
Cooling:
Front Intake: 140 x 140 x 25mm red LED Fan 1000RPM, 16dBA
Rear (Exhaust): Two 120 x 120 x 25mm TurboFan 1300RPM, 17dBA
Top (Exhaust): 230 x 230 x 20mm fan 800RPM, 15dBA
Bottom (Intake): 120 x 120mm fan (optional)
CPU (Exhaust): 120 x 120mm fan (Optional)
Fanbar (Intake): 120 x 120 25mm TurboFan 1300RPM, 17dBA
Side (Intake): 230 x 230 x 20mm fan 800RPM, 15dBA
Motherboard: Micro ATX, Standard ATX
Drive Bays:
5.25" Drive Bay - 7 x 5.25"
3.5" Drive Bay - 1 x 3.5" (Converted from one 5.25" drive bay)
3.5" Drive Bay (hidden) - 6 x 3.5"
I/O Ports: USB2.0 x 2, e-SATA connector x 1, HD Audio
Expansion Slots: 7
PSU: Standard ATX PSII (Optional)
Interestingly, Thermaltake have two Spedo chassis' available - the Spedo Advance Package and the Spedo. The differences between the two are: a small weight reduction in favour of the Spedo because it doesn't come with CRM partitions; and the Spedo loses the large 230mm fans on the roof and side-panel for 120mm and 140mm variants.
Let's head over the page to check out the packaging and contents...
Most Recent Comments
the xaser and the armor+ are still the best made thermaltake cases out there to my opinion. and these 2 are in par with cooler master cases to, wich is good. but it is true that lian li is still be best branch for cases, becouse of the finishes they have on their cases, but it also comes with a big price ofcource.Quote
The case has actually grown on me as I stated in the review, and as you said it does have an industrial look to it. I think that look adds to the appeal somewhat.
Even though the screwless expansion card holders are plastic they do feel very solid and not likely to snap or crack. I too would have preferred modders mesh over the louvres.
While I can't comment on the Armor+, the Xaser VI is so bloody heavy. I found the weight difference between the Spedo and the Xaser VI to definitely fall in the favour of the Spedo.
Thanks for the feedback too guys - tis muchly appreciated
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Originally Posted by Diablo
I have concerns over the screwless expansion card connectors and the use of plastic. Another thing I dislike is the placement of the PSU and the use of louvres not of mesh.
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I'm not fussed by the squares personally. But considering that you can see into the back of the motherboard tray via the side panel, they sort of become a necessity. As for the thumbscrews, I really like the ones on the Spedo as opposed to those on the Xaser VII like the idea of the plastic squares on the back of the mobo, but at the end day it is only wire you are covering up. I also notice they've changed the thumbscrews on the back of the case...the worst feature of the Xaser VI
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Originally Posted by name='Robert'
the xaser and the armor+ are still the best made thermaltake cases out there to my opinion.
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Thanks for the feedback too guys - tis muchly appreciated
QuoteQuote:
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Originally Posted by name='Robert'
the xaser and the armor+ are still the best made thermaltake cases out there to my opinion. and these 2 are in par with cooler master cases to, wich is good. but it is true that lian li is still be best branch for cases, becouse of the finishes they have on their cases, but it also comes with a big price ofcource.
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Just wonderidng, does thev case have a removable mobo tray...that was an excellent thing on the xaser that cut down RMA stripping time by about an hour
That's good news about the screwless holders, on the Xaser, I just stripped them off because they didn't work with the 280GTXs or the DX2...bit of a pain. Also the screwless 5.25 won't fit shorter (without 2 screw holes) components like the Pico ITx or most fan controllersQuote
CSS Valid
However the case leaves a bit to be desired by the look of it. The Thermal areas thing clearly doesn't work and 50 something decibels is really obnoxiously loud. The looks are fairly subjective so I won't comment, aside from saying it has quite a nice industrial look (from the pics...maybe not in the flesh).
I have concerns over the screwless expansion card connectors and the use of plastic. Another thing I dislike is the placement of the PSU and the use of louvres not of mesh.
I like the idea of the plastic squares on the back of the mobo, but at the end day it is only wire you are covering up. I also notice they've changed the thumbscrews on the back of the case...the worst feature of the Xaser VI
Speaking from experience with Thermaltake cases, they are not as bad as they used to be and while they lack the finish of Lian li, they aren't as bad as everyone says. Still wouldn't buy this one though.Quote