Battle of the Goop - Thermal Paste Comparison
Introduction
Published: 5th August 2006 | Source: WaterCoolingUK | Price: |
Affectionately named 'goop', Thermal Interface Compound (TIC) plays a key role in transferring the heat from your processor to your heatsink or water block. There are 3 primary types of compound: Silicone, Ceramic and Metal based all of which have their advantages and disadvantages and varying levels of performance.
Today I'll be testing out 4 different types of Metal based TIC from 3 different manufacturers to see if there really is a worthwhile reason for switching from that generic "white stuff" that came with your heatsink.
And here are the candidates. Left to right we have: Shin Etsu X23-7762, Shin Etsu G751, Coollaboratory Liquid Pro and the ever popular Arctic Silver 5.
Luckily nobody walked in on me during this photo shoot, otherwise I might have been taking a trip down to the local police station to explain my collection of substance filled needles!
Let's take a closer look....
Most Recent Comments
I am sorry, but I fail to see the difference between this and the standard card.Quote
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Originally Posted by name='Nagaru'
I am sorry, but I fail to see the difference between this and the standard card.
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If AMD want to sell them then they need to cut the price by £70-100. Not stick a differeent hs on.Quote
is the GT lower than the Pro in terms of performance?Quote
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Originally Posted by name='ichiban'
is the GT lower than the Pro in terms of performance?
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