DRAM innovator Viking Modular today announced the addition of all new high-density DDR3 modules to its product line-up. The single form factor RDIMM module is a high performance once that meets the most stringent
Viking has used its patent-pending BGA stacking technology to design this 8 GB DDR3 module. Created keeping OEM customers in the telecommunications, enterprise, cloud, and embedded computing markets in mind, the new module is an 8GB model that is Very Low Profile (VLP) Registered. Its unique technology that combines high density in a very low profile form factor makes it ideal for even the most demanding conditions.
The VLP modules have been designed using mainstream 2GB DDR3 DRAM modules. Notable features of the new RDIMM include extraordinary thermal performance from -40 degrees C to 85 degrees C and PC3 range from 6400 to 10600. The module has been equipped with thermal sensing energy management system, which gives it an extremely low voltage profile of 1.35V to 1.5V.
A DDR3-1333 module, the VLP RDIMM meeds JEDEC Standard MO-269 as well as SWaP military COTS requirements. The overall combination is a memory module that is extremely cost effective, reliable, and perfectly suited to blade servers, storage bridge bay (SBB), AdvancedTCA (ATCA), and multiple space constrained high performance computing environments.
The new RDIMM has already been released to OEM partners, but pricing for the same is still not known.
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