Yangtze Memory announces mass production of 64-layer 3D NAND as China's tech investment bears fruit
China's moving into the 3D NAND business.
Published: 3rd September 2019 | Source: Digitimes |
Yangtze Memory announces mass production of 64-layer 3D NAND
Now, Yangtze Memory has announced that they have started to mass-produce 256Gb 3D NAND chips that are based on the company's 64-layer 3D NAND technology. These new memory chips use Yangtze's in-house Xtacking technology.
In 2020, Yangtze expects to grow its output to 100,000-150,000 wafers per month, significantly increasing their presence within the NAND market. Moving forwards, Yangtze plans to skip 96-layer NAND tech to accelerate the development of their 128-layer NAND. With this strategy, Yangtze hopes to catch up to its foreign competitors.
Yangtze memory's production capacity is due to increase in 2021/22 with the opening of a new factory site in Chengdu. This new location is due to offer an initial production capacity of 100,000 wafers per month.
Thanks to China's new state-backed semiconductor startups, the world will soon start to see the effects of renewed competition within the DRAM and flash storage markets. Even so, China's fledgeling foundry startups remain far behind their foreign rivals technologically. Even so, increased NAND and DRAM supply should be seen as a good thing for consumers, as increased supply often leads to lower prices.
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