SK Hynix announce the mass production of their latest 72-layer 3D NAND
SK Hynix has achieved
SK Hynix's 4th Generation 72-layer 3D NAND is now in mass production
Back in April, SK Hynix revealed their 4th Generation 72-layer 3D NAND, which will offer storage densities of 256Gb per chip and offer similar productivity to Samsung's latest 64-layer V-NAND.
Over the past three months, SK Hynix's engineering and management teams have worked tirelessly to improve the yields of their latest memory technology, as previously they were nervous that their silicon yield would be less than 50%.
SK Hynix has been said to have had a ‘battles with yield’ for past 3 months, with their management team and engineers spending many late nights doing research. As a result of this tremendous effort, yields for their new 72-layer 3D NAND are said to have "went up vertically" and has become comparable to Samsung Electronics’ yield. Today Samsung are leaders of the NAND flash market, so these results can be seen a nothing other than impressive.
SK Hynix has also moved to create their own controller technology, rather than rely on 3rd party technology, allowing the company to keep production in-house and increase their profit margins for completed SSDs.
SK Hynix is also said to be creating eMMC (embedded Multimedia card) products for mobile devices.
You can join the discussion on SK Hynix's new 72-layer 3D NAND on the OC3D Forums.
Most Recent Comments