'

TSMC cleared to construct 3nm chip factory in Southern Taiwan

TSMC is investing $19.5 billion in the fab

TSMC cleared to construct 3nm chip factory in Southern Taiwan

TSMC cleared to construct 3nm chip factory in Southern Taiwan

TSMC has confirmed that they have received the go-ahead to construct their first 3nm fab in Southern Taiwan. This fab will be placed in Tainan's Taiwan Science Park, sitting close to TSMC's planned 5nm fab, which is set to start producing chips in late 2019 or early 2020. 

The new factory is expected to cost $19.5 billion to construct, with the facility itself relying on 20% renewable energy and 50% recycled water, factors which allowed TSMC to pass the facility's environmental protection assessment.  

In 2019, TSMC is expected to ship 7nm silicon in high volumes, acting as a key upgrade to AMD's planned Zen 2 series products and their next-generation Radeon graphics hardware. If all goes to plan, TSMC will start producing 5nm chips in 2020 and will have their new 3nm fab up and running in late 2022/early 2023, though don't expect 5nm and 3nm chips to hit consumers as soon as the factories open. 
 
With every major lithography node shift, transistors become more densely packed and often becomes more energy efficient, allowing processors to become more complex and powerful. This makes process node shrinks a vital part of the PC industry, as these nodes are relied upon to deliver power and performance improvements. 

TSMC cleared to construct 3nm chip factory in Southern Taiwan  

At the time of writing, there are only three foundries that offer leading-edge lithography technology, TSMC, Samsung and Intel, with Global Foundries recently dropping out of the race. Creating each new lithography node is an expensive process and has become more difficult with each generation, though for now, TSMC seems content that they can continue pushing forward, at least until 3nm. 

You can join the discussion on TSMC's plans to construct a new 3nm foundry on the OC3D Forums.   

«Prev 1 Next»

Most Recent Comments

21-12-2018, 10:45:15

Dawelio
The money involved, $19.5 billion dollars! Jesus christ!Quote

22-12-2018, 10:01:37

RobM
Pretty impressive they are still able to push the envelope at that costQuote

22-12-2018, 11:18:53

ImprovizoR
There's only so much they can do with silicon though, right? We're almost at the end of the road.Quote

22-12-2018, 18:26:13

Avet
Quote:
Originally Posted by ImprovizoR View Post
There's only so much they can do with silicon though, right? We're almost at the end of the road.
I think 2.5 nm is sort of the minimum. But we are long way from using something other than silicon. It is not the size that matters, it is how you use it. (That is definitely not what she said ) The most important of all is density, and then the architecture itself. Current multiple patterning lithography has reached it's limit. EUV lithography is what will be the main process for a long time. And for the far future, brains at MIT and University of Colorado are working on ALE (Atomic Level Etching) technique. That is some crazy science fiction stuff. Amazeballs! Also more, and more manufacturers are turning to software optimizations, rather than raw horsepower. There is so much performance to be gained there.

Silicon is here to stay. I don't see it leaving for decades.Quote

25-12-2018, 22:42:06

realneil
3nm, Man how things progress over time!Quote
Reply
x

Register for the OC3D Newsletter

Subscribing to the OC3D newsletter will keep you up-to-date on the latest technology reviews, competitions and goings-on at Overclock3D. We won't share your email address with ANYONE, and we will only email you with updates on site news, reviews, and competitions and you can unsubscribe easily at any time.

Simply enter your name and email address into the box below and be sure to click on the links in the confirmation emails that will arrive in your e-mail shortly after to complete the registration.

If you run into any problems, just drop us a message on the forums.