Packaging & Appearance
Because of the close proximity of the memory modules on i7 motherboards, Thermalright recommend both the Type H (High) and Type L (low) profile kits so that both kits can be used in unison with one another. Here, we look at each kit in greater detail:
The packaging the Ram cooler arrives in is a standard Thermalright affair with a plain brown cardboard box, printed with the Thermalright logo and product name on the front with a small window cutout displaying the cooler inside. The rear of the box features much the same but this time including the product specification.
Opening the box up we are a greeted with the coolers themselves which are held tightly in place by means of moulded Styrofoam. Also included in the box are 6 full length thermal pads complete with removable backing. A large sticker and an easy to follow instruction leaflet are also included.
The Type H variant of the Ram cooler is unsurprising the highest of the two kits, standing 60.37mm high (almost 2.5" for those still working with imperial measurements). Two nickel plated copper heatpipes attach the finned array to the ram cooler plates ensuring super efficient thermal transfer from the plates to the outside air with minimal fuss.
The base plates are very thin yet sturdy enough not to bend accidentally and because the heatpipes are flattened to the plates on both sides, the ram cooler should not foul any module sitting along side. The main fin array may however cause difficulties in this area, something I will investigate later in the review in the test setup area.