Battle of the Goop - Thermal Paste Comparison
Published: 5th August 2006 | Source: WaterCoolingUK | Price: |Introduction
Affectionately named 'goop', Thermal Interface Compound (TIC) plays a key role in transferring the heat from your processor to your heatsink or water block. There are 3 primary types of compound: Silicone, Ceramic and Metal based all of which have their advantages and disadvantages and varying levels of performance.
Today I'll be testing out 4 different types of Metal based TIC from 3 different manufacturers to see if there really is a worthwhile reason for switching from that generic "white stuff" that came with your heatsink.
And here are the candidates. Left to right we have: Shin Etsu X23-7762, Shin Etsu G751, Coollaboratory Liquid Pro and the ever popular Arctic Silver 5.
Luckily nobody walked in on me during this photo shoot, otherwise I might have been taking a trip down to the local police station to explain my collection of substance filled needles!
Let's take a closer look....