USB 3.0 Specification Now Available Page: 1
USB 3.0 Specification Now Available
 
The USB 3.0 Promoter Group today announced the completion of the USB 3.0 specification, the technical map for device manufacturers to deliver SuperSpeed USB technology to the market.

SuperSpeed USB brings significant power and performance enhancements to the popular USB standard while offering backward compatibility with billions of USB-enabled PCs and peripheral devices currently in use by consumers. Delivering data transfer rates up to ten times faster than Hi-Speed USB (USB 2.0) with optimized power efficiency, SuperSpeed USB is the next step in the continued evolution of USB technology.

“SuperSpeed USB is the next advancement in ubiquitous technology,” said Jeff Ravencraft, USB-IF president and chairman. “Today’s consumers are using rich media and large digital files that need to be easily and quickly transferred from PCs to devices and vice versa. SuperSpeed USB meets the needs of everyone from the tech-savvy executive to the average home user.”

The USB 3.0 Promoter Group, comprised of Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, NEC Corporation, ST-NXP Wireless and Texas Instruments, developed the USB 3.0 specification. The group now has transitioned the specification’s management to the USB Implementers Forum (USB-IF), the managing body of USB specifications. The USB 3.0 Promoter Group is now accepting adopters of the USB 3.0 specification, which has been finalized at the 1.0 level. To download both the specification and adopter agreement, visit http://www.usb.org/developers/docs/.

It is anticipated that initial SuperSpeed USB discrete controllers will appear in the second half of 2009 and consumer products will appear in 2010, with adoption continuing throughout 2010. The first SuperSpeed USB devices will likely include data-storage devices such as flash drives, external hard drives, digital music players and digital cameras.

The USB 3.0 specification debuted today in conjunction with the first SuperSpeed USB Developers Conference in San Jose, California. The conference provides attendees the first opportunity to hear directly from the creators of the USB 3.0 specification; keynote speakers will address advancements offered by the new technology. In addition to technical sessions, an exhibit area will showcase the latest developments and early designs featuring SuperSpeed USB technology. Attendees will obtain information on the best practices for incorporating SuperSpeed USB into their product roadmaps.

The USB 3.0 specification includes many advancements for both consumers and adopters, including higher speeds and enhanced power efficiency. For more information about the USB 3.0 specification, visit http://www.usb.org/developers.
 
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