Thermaltake Technology will be attending the SMAU 2007 Page: 1


Official Press Release


Thermaltake Technology will be attending the SMAU 2007 International Exhibition of Information & Communications Technology in Italy this October. The great event will be held at Fiera Milano, new Exhibition Center in Rho Pero in Italy from Wednesday October 17 to Saturday October 20, 2007. Thermaltake will be booth at Hall 11, No. 22

Among the “Key 3 Spirit” products of Chassis, Cooler and PSU, there are the latest innovation of Touch Screen HTPC, “DH101” and “DH102”; the high reliability and stability “Toughpower 1500W” power supply, and the fusion of appearance, performance, and silence “V1” and “MaxOrb” CPU cooler. And the mMost attractive items will be the all new Xaser VI and Armor+ cases which are not available in the market yet.  The innovative designs provide independent thermal solution for VGA, CPU and HDD section. The top sliding hood provides extreme convenience for an internal liquid cooling system maintenance or allows easy access to the extra storage space for air cooling system. In order to allow enthusiasts to be the trend setters with Thermaltake creations, Xaser VI and Armor+ will be the only case in the market that equip with 10 PCI slot and 14 drive bays to support extreme expandability and user friendliness.



Event:       SMAU 2007 Italy
Date:         10/17/2007 ~ 10/20/2007
Time:         9:30 a.m. to 6:30 p.m
Location:   Exhibition Hall 11, No.22


ThermalTake @ SMAU


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