Contained within the blister pack is a printed card insert that provides a contrasting background to the modules. I was hoping that OCZ may have come out with an entirely new design for this insert, but unfortunately it shares much the same design as the card used on their earlier
DDR2 kits.
Around the back of the card are excerpts from previous OCZ reviews by several other websites. It would have been nice to see some kind of specifications table, but as the card inserts are no doubt mass-produced, it would make things considerably harder (and more expensive) to have a different insert for every model of OCZ memory.
AppearanceThe PC3-12800 Platinum modules utilise OCZ's patented XTC heatspreader. The XTC heatspreaders ensure that the thermal management of memory modules is promoted through greater airflow and by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.
For those of us with a keen eye, you will notice that OCZ have updated the XTC heatspreaders slightly for the DDR3 series by placing a '3' at the top right of the 'Z' logo. We could argue that OCZ should have made a more radical change to the XTC design to make the DDR3 kits easily distinguisable, but in all fairness most manufacturers have only made minor changes to their heatspreader designs for the arrival of DDR3.
The XTC heatspreaders are held in place with very thin double-sided thermal tape. This certainly proved to be a very effective method of securing the heatspreaders as removing them was extremely difficult. If you are planning on replacing the heatspreaders with an alternative solution (maybe water cooling?) then I would certainly suggest warming the modules up first and using a credit card to prize them apart.