Samsung Develops 16-Chip Multi-Stack Package Technology

"Samsung Develops 16-Chip Multi-Stack Package Technology"

Search News

  • Scrolling Image
  • Scrolling Image

Samsung logo

Samsung Electronics Co., Ltd. announced that it has developed the industry's first process to enable production of a 16-chip multi-chip package of memory. The new MCP technology supports the industry-wide demand for small form factors and high-densities that will accommodate multimedia-intensive user applications.

Samsung's new 16-chip MCP technology, when applied to 8Gb NAND flash chips, can enable up to a 16 gigabyte MCP solution. Advanced multi-chip package technology requires a combination of key processes such as wafer thinning technology, redistribution layer technology, chip sawing technology and wire bonding technology.

To increase the number of chips stacked vertically, the need for further wafer thinning was a critical design obstacle. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated-wafer to reduce the overall thickness to only 30-micrometers. This is 65% the thickness of the 10-chip MCP wafer (45µm) Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30 µm.

Samsung also developed a new laser-cutting technology to cut the wafer into individual chips. This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80µm-thick.


Feel free to discuss this technology in our forum

«Prev 1 Next»

Most Recent Comments

02-11-2006, 12:50:30

Found a beta BIOS for the ABIT AW9D and MAX, and it adds in the tRef setting for manually setting RAM timings. Master of None posted on the ABIT forum that he could raise the tRef to achieve higher overclocking, and he was correct... but apparently at a price. I was testing 3dmark05 and 06 for hours last night, and found that while 3dm05 would give me higher scores after a good pump up of the FSB, 3dm06 wouldn't. At 3509MHz, BIOS 12 RAM settings outperformed the new BIOS and upped tRef, even when I jumped up to 3550MHz (approx.); a score of 9694 at 3509MHz vs 9680 at 3550MHz = wth?! Since the tRef is the only thing that's been changed, anyone mind telling me what they know about this setting? My RAM is DDR2-800, SPD=5-5-5-15, set to 4-4-4-12 and a tRef of 36; speed is approx. 395MHz.


02-11-2006, 12:57:02

tref was where it was at on A64. Changing this made a helluva lot of difference to your overclock

A bit of info:

TREF is the # of clock cycles between RAM refreshes. (Information in RAM is stored in capacitors and decays/disipates over time.. requiring periodic refresh of information before it disappears)


Register for the OC3D Newsletter

Subscribing to the OC3D newsletter will keep you up-to-date on the latest technology reviews, competitions and goings-on at Overclock3D. We won't share your email address with ANYONE, and we will only email you with updates on site news, reviews, and competitions and you can unsubscribe easily at any time.

Simply enter your name and email address into the box below and be sure to click on the links in the confirmation emails that will arrive in your e-mail shortly after to complete the registration.

If you run into any problems, just drop us a message on the forums.