Club 3D 8400 GS 512MB Passive

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Official Press Release

Club 3D 8400 GS 512MB Passive

Awesome features at an incredible value - NVIDIA® GeForce® 8400 graphics processors deliver. Essential for watching HD DVD and Blu-ray movies on a PC, accelerating the Microsoft® Windows Vista™ experience, and powering Microsoft® DirectX® 9 and DirectX 10 games.

The Club 3D 8400GS Passive provides a 800MHz 512 MB GDDR2 memory and a GPU Speed of 450MHz.

* NVIDIA® Unified Architecture
* NVIDIA Quantum Effects™ Technology
* NVIDIA Lumenex™ Engine
* NVIDIA PureVideo™ HD Technology

Operating Systems
* Built for Microsoft Windows Vista
* Windows XP/Windows XP 64
* Linux

1x Dual Link DVI, 1x CRT
High Quality display outputs to drive an LCD panel with resolutions up to 2560x1600 full digital with new Dual Link DVI technology. Two high speed 400MHz RAMDAC’s to create ultra sharp images on CRT monitors up to 2048x1536 at 85Hz. An intelligent driver to create any resolution below. Full dual monitor support for analogue and digital displays.

High Definition Video Output
True 1920 x 1080 Progressive (1080p) display output to generate the best image quality possible on plasma or LCD Televisions.

Passive Cooling
For optimal reliability, lifespan and ergonomics, Club 3D implements a passive cooling system to keep your graphics card in a healthy and silent condition during the most demanding gaming and video applications.

8400 GS 512 passive

Find out more about the Club 3D 8400 GS 512MB Passive here

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Most Recent Comments

15-09-2007, 05:48:25

Consider, if u will, a diy construction of 2 cases. Both are going to contain a workhorse pc setup, meaning they`re going to have fair rated components, some tweaking and clocking and a `good` arrangement of air flow and ventilation.

If the material of the framework/case for 1 is metalic, millimeters thick, and the other wood/plastic-hybrid, probably centimeters thick, would it be fair to say that the temperature of the systems as a whole internally would be higher with the non metalic as the nature of the material is essentially an insulater ?

Possible consideration would be to have a heat-reflective surface to the non-metalic inside of the case, like a metalic tape ? (the type u may see as a moisture barrier on a wooden sub-floor installation)

15-09-2007, 07:16:23

Mr. Smith
You are certainly asking some interesting questions...

I'd say there would be a negligible difference between either case temp.

As long as the cases had a good airflow...

15-09-2007, 08:22:57

The wood probably be slightly warmer, as you said due to it acting more like insulation.. As for metalic tape on the inside you will have to try that one out..
Either way i dont think the temperature difference would be all that high, providing as Mr. Smith said good airflow is provided.

15-09-2007, 09:14:01

I've had perspex, steel and aluminium cases and the warmest case was by far the perspex, followed by the steel one. A wooden case would retain heat considerably as well because the wood acts as an insulator. But if you provide sufficient case ventilation then both are viable alternatives, but remember the timber case may be heavier (depending on thickness).

15-09-2007, 11:59:04

I have been built a couple of diy cases with 90% wood and no problems with temperature despite one of the systems being a low airflow watercooling setup. That said they have been biggish so they have plenty of air volume inside.

15-09-2007, 12:30:29

My feeling was when thinking of radiators, and mosfet type finishes.

U`r goal in brushing air across the surface of a materlal would be to keep the exchange from the material to air constantly replenished with fresh cooler air. Way I look at this is that if no air is circulated away from the area, the material just radiates it`s surroundings. U blow it away, the surrounding is cooler.

Big consideration can be the consistancy of the heat sink material. If u enclose u`r heatsink, and allow air pockets inside the metalic sink, disapation will be less efficient. Similarly if u put an insulation around it`s surface facing the airflow. U inherently keep heat in situ.

Following this to wood/plastics, if u do have an insulating material as a case, this material will heat up over time. It`s disapation to air is poor, so the efficiency of cooling is a lot less.

I have a shelf mounted on a wall with 20-25cm shelf space allocated to a mobo and it`s gear. (the shelf space is variable). After being in situation for a fair while, I feel the nature of the wooden shelf base is esculating the temps as u go up the levels. In effect the lowest shelf raising the base temp of the one above it. Air flow is good.

15-09-2007, 12:56:23

I agree with your reasoning but I never rely on the case acting as a heatsink whatever it happens to be made of (I cover the inside of my cases with soundproofing material). :) Have to put a bit more consideration into getting decent airflow and avoiding hot-spots though.

I'd love to make a case out of wood some day. :yumyum:

15-09-2007, 17:25:52


I agree with your reasoning but I never rely on the case acting as a heatsink whatever it happens to be made of (I cover the inside of my cases with soundproofing material). :) Have to put a bit more consideration into getting decent airflow and avoiding hot-spots though.

I'd love to make a case out of wood some day. :yumyum:

It`s kinda semi funny u should say that. The metalic tape is sold as an accessory to a wood-floor underlay. That underlay has a metalic finish, similar to the tape, with sound proofing qualities :)

Mdf is just practically easy to work with. Very hard to keep looking smart tho. Especially with u`r end result.

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