OQO First to Ship 1.6 GHz VIA C7-M ULV Processor
"VIA and OQO push the performance envelope for Ultra Mobile Devices"
Published: 11th September 2007 | Source: VIA |
OQO First to Ship 1.6 GHz VIA C7-M ULV Processor in Latest Addition to Award-Winning model 02 Product Line
VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced that OQO Inc. is the first manufacturer to ship the 1.6GHz VIA C7-M ULV processor in the latest configurations of its award-winning model 02 product line.
The higher-speed processor in this update of the OQO model 02 – the world’s smallest full-featured Windows Vista® PC – further increases the device’s performance and thus enables mobile professionals to enhance their anytime/anywhere productivity.
In addition to a faster processor, the OQO model 02 update now also features configurations with options such as support for the super fast “EVDO Rev. A” high-speed wireless transmission standard, which delivers data rates of up to 1.4Mbps, improved upstream speed and lower latency. The update also offers enhanced storage capacity of up to 120GB, and an SSD (solid state drive) option is also available.
“We are delighted that OQO has adopted our 1.6GHz VIA C7-M ULV processor for their model 02 computer,” commented Richard Brown, Vice President of Corporate Marketing, VIA Technologies, Inc. “This provides further evidence of our leadership in developing cutting-edge platforms for the rapidly growing UMD market.”
“We have once again extended the performance envelope of ultra mobile computing,” said Bob Rosin, senior vice president of marketing & alliances, OQO. “With its faster CPU, increased hard drive capacities, SSD option and improved wireless capability, the new model 02 is the ultimate device for mobile professionals who want access to all their information, applications and the Internet wherever they go.”
About the VIA C7-M Ultra Mobile Platform
VIA’s core design strengths of low power draw, extreme miniaturization and a wide range of integrated features have made the VIA Ultra Mobile Platform and the VIA C7-M ULV processor the number one choice for the emerging new generation of Ultra Mobile Devices, which deliver full PC functionality and a complete, no-compromise Internet experience in an ultra compact form factor. The VIA C7-M Ultra Mobile Platform is based on the low power drawing VIA C7-M ULV x86 processor, which has been specifically designed for small form-factor Ultra Mobile Devices (UMDs).
The VIA C7-M ULV processor is based on the VIA CoolStream architecture and manufactured using an advanced 90nm process, and has a low profile nanoBGA2 package measuring just 21mm x 21mm. VIA C7-M ULV processors are available at speeds of 1.0-1.6GHz with a maximum thermal design power (TDP) as low as 3.5 watts and idle power as little as 0.1 watt, ensuring unparalleled battery life. This is complemented by a highly integrated and power efficient unified chipset, enabling designs with drastically reduced weight, size and thickness. More information on the VIA C7-M Ultra Mobile Platform and UMD partner products may be found on the VIA website at:
To learn more about the Ultra Mobile Lifestyle, please join our vibrant community of mobility enthusiasts at: www.ultramobilelife.com
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