Nehalem set for bigger and stronger mounting system
"Intel have made some changes to how CPU coolers will mount to socket LGA1366 (Nehalem) motherboards"
Published: 7th April 2008 | Source: The Inquirer |
The Inquirer have reported that the socket on the upcoming LGA1366 (Nehalem - Bloomfield & Gainestown) based motherboards is not only 20 per cent bigger on each side than the socket LGA775 for the current Penryns, but it also seems far more robust when looking for a nice secure mount.
It seems that Intel have given some thought as to what changes to make to improve this socket. I imagine these changes will be welcomed but it also has to be mentioned that it seems Intel have stuck with the push-pin cooler design that people have been calling to be scrapped for ages.
Also with the socket change, inevitably, the mounting holes for cooling solutions have also changed. This means anyone who has shelled out on a top end heatsink and fan will more than likely be looking at having to buy a new one. For those with water-blocks that can change their mounting plates.. Hope remains. The size of the LGA1366 socket with the new retention mechanism fitted measures 60x82mm, compared to 58x61mm for current LGA775 processors.
While this isn't going to bother us any time soon, it gives a little more info on what we can look forward to in the future.
Let us know what you think. Discuss in our forum.