Intel Moves Forward With 32nm

"Intel Completes Next Generation, 32nm Process Development Phase"

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Intel Moves Forward With 32nm

Intel Corporation has completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers (a billionth of a meter). The company is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.

Intel will provide a multitude of technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices meeting (IEDM) next week in San Francisco. Finishing the development phase for the company's 32nm process technology and production readiness in this timeframe means that Intel remains on pace with its ambitious product and manufacturing cadence referred to as the company's "tick-tock" strategy.

That plan revolves around introducing an entirely new processor microarchitecture alternating with a cutting edge manufacturing process about every 12 months, an effort unmatched in the industry. Producing 32nm chips next year would mark the fourth consecutive year Intel has met its goal.

The Intel 32nm paper and presentation describe a logic technology that incorporates second-generation high-k + metal gate technology, 193nm immersion lithography for critical patterning layers and enhanced transistor strain techniques. These features enhance the performance and energy efficiency of Intel processors. Intel's manufacturing process has the highest transistor performance and the highest transistor density of any reported 32nm technology in the industry.

"Our manufacturing prowess and resulting products have helped us widen our lead in computing performance and battery life for Intel-based laptops, servers and desktops," said Mark Bohr, Intel Senior Fellow and director of process architecture and integration. "As we've shown this year, the manufacturing strategy and execution have also given us the ability to create entirely new product lines for MIDs, CE equipment, embedded computers and netbooks."

Other Intel IEDM papers will describe a low power system on chip version of Intel's 45nm process, transistors based on compound semiconductors, substrate engineering to improve performance of 45nm transistors, integrating chemical mechanical polish for the 45nm node and beyond; and, integrating an array of silicon photonics modulators. Intel will also participate in a short course on 22nm CMOS Technology.

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Most Recent Comments

05-12-2008, 12:04:39

Would be one of the most stupid deaths you can die :P

05-12-2008, 12:05:51

Concept has been floating around for a while now.

Chalked it down as a waste of time the first pass...

05-12-2008, 12:07:51

****opens window*****

There thats 10c off my temps.:D

05-12-2008, 12:11:59


Would be one of the most stupid deaths you can die :P

too right...although I did read about a german guy who was found dead in a video porn booth....the doctor said they "could not assertain the cause of death"

obviously the 5 knuckle shuffle is not valid a valid death on a death certificate

05-12-2008, 12:48:51


obviously the 5 knuckle shuffle is not valid a valid death on a death certificate


05-12-2008, 17:24:15

Read somewhere that they have found a new method of cooling, this was awhile ago though.

They sent electric charges through the CPU and was able to cool it down to around 20c on max load. This was from some website, I would find it if I had saved it.

Spose it was a lie?

05-12-2008, 17:41:03

Electic charges only have the capibility to warm things up. A possibility would be a concept equal to the fridge, which would cause one side to be warm and the other to be cold... It's already in use by extreme overclockers, but the beer keeps me from remembering the name of it.

06-12-2008, 05:16:38

no hes right...its called thermal electric cooling (TEC) and has been around for a while...not a big seller because of condensation...however they are getting better..i like the look of this cooler because the TEC doesnt kick in unless cpu load is above 40%...nice idea

check this out for more info

06-12-2008, 05:43:51

I think the most promising cooling for mainstream users is ionic wind cooling. Admittedly, a commercial version is quite a way off, but the potential uses for it are endless. Plus it may mean that we can have CPU coolers that can start shrinking in size instead of gaining it.

06-12-2008, 07:15:31

the problem with anything in research phase is that if it take ay 10 years to develop usually a simpler more cost effective route is found...usually in primary development for example die shrinkages...any new cooling method is most welcome if it performs well...but theres a big difference between R&D and practical application...and TMC actually addresses the issue at the source of the heat rather then the layer above a nice idea but im reconing a tmc application on the atual cpu die rather then the cooler may result in the best cooling solution ever...however...heat is an unwanted by product so eliminating that heat from ever being created..afterall it is a waste of what cpu manufacturers are gearing 20 years time who knows maybe cpu coolers will be as absolete as gas lighting...nano tube technology is gonna be the next thing for cpu's and from what the theoretical papers say it comes with a 98% processing efficiency...meaning only 2% lost in heat and other unsavoury by that against our 65-72% now...but yes its theoretical...check here for more carbon nano tube info

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