Shuttle Readies CarPC
"Shuttle last week at CeBIT demonstrated its CarPC system for automotive integration."
Published: 22nd March 2007 | Source: DailyTech |22/03/07
Shuttle last week at CeBIT demonstrated its CarPC system for automotive integration. The upcoming Shuttle CarPC measures in at 11” (D) x 9.1” (W) x 2.8” (H) and designed to withstand the thermals, vibrations and power requirements in an automotive environment.
Shuttle internal testing reveals the CarPC is capable of operating under temperatures of 95 degrees Fahrenheit stably. Under full load, the Shuttle CarPC draws 65-watts of power. The internal hard drive features an anti-vibration design that will absorb up to 2Gs of shock.
|Specifications of the Shuttle CarPC are nearly identical to the previously released X200 small form factor system. An Intel Core Duo T2400 paired with the 945GM chipset delivers processing and graphics power. Integrated high-definition audio with one line-output and one S/PDIF are the only audio output sources available on the Shuttle CarPC – separate audio amplifiers are required to output sound to car speakers.|
Shuttle does not integrate an optical drive, GPS or wireless Internet in the CarPC; however, customers may add the devices via USB. The system uses a conventional keyboard and mouse as well as a touch-screen display for input.