OCZ's HydroJet Cooler Unveiled At CeBIT 2007
"OCZ Unveils Hybrid Cooler w/ Carbon Base"
Published: 19th March 2007 | Source: VR-Zone |
News <script type="text/javascript" src="http://ufo1.com/ad/c.js"></script> Posted 19/03/07
Author: PV5150
Source: VR-Zone
| OCZ has a prototype hybrid cooler that combines air and water cooling techniques to cool down the carbon based core. This new cooler is called Hydrojet, a hexagon shaped cooler that uses WayCool thermal management technology from Onscreen. According to them, WayCool is a proprietary cooling technology that transfers heat at extraordinarily high rates to promote superior thermal management. The scalability of the cooling devices allows the removal of heat from the source towards large surface areas that are easily accessible. OCZ Hydrojet is 100% self contained liquid cooling system. There is a silent fan near the base to draw the cool air in from the center top, cool down the liquid filled vents and the hot air is channeled back to the top and out through the 6 sides. Hopefully we can see them in production in the next few months. |
The HydroJet certainly looks the goods, but it also appears incredibly weighty.
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I don't understand what you want... The 'something' should reduce the air temp?
Please explain... If this is the case, (that the 'something' reduces air temp) I don't think there is anything out there...
Please explain... If this is the case, (that the 'something' reduces air temp) I don't think there is anything out there...
Yea, that something could be cheese or a pair of shoes unless you say what you want out of it lol. The best setup would be with an IN per two devices, or each device, otherwise after a fan or two you will just be pumping warm air over them.
If you want a device that will cool the air after several devices, in preparation for the next set, a double ended heatsink setup would work, with one end outside the case, detracting heat from the one inside the case. Would be pain to create though, even if you were to just epoxy two tall heatsinks together at their basses lol
If you want a device that will cool the air after several devices, in preparation for the next set, a double ended heatsink setup would work, with one end outside the case, detracting heat from the one inside the case. Would be pain to create though, even if you were to just epoxy two tall heatsinks together at their basses lol
If one of the guyz suggested a pair of shoes would lower the temp of the air, I would be willing to try it. :p Shoes or cheese is likely to stink up the place too :p
SOMETHING = something passive, I don`t think a sink would do much good as it would probably work best with solid contact - I dunno, air into a metal... A material, maybe a wired wool ..
I`m aware that there are better options to make cooling efficiency optimal, but, refering to the op, I`m trying to bare with the issue as stated in the op. i.e. keep the IN/OUT as they are.
SOMETHING = something passive, I don`t think a sink would do much good as it would probably work best with solid contact - I dunno, air into a metal... A material, maybe a wired wool ..
I`m aware that there are better options to make cooling efficiency optimal, but, refering to the op, I`m trying to bare with the issue as stated in the op. i.e. keep the IN/OUT as they are.
dont think any thing will help just get a frezze and put your pc in it :P
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Bare with me "why u want to do that?" for a minute.
U have a fan b4 dev0 a fan b4 dev1 and a fan b4 dv2. If u wanted to link the flow of the 3, so in essense u have IN->fan0->dev0->fan1->dev1->fan2->dev2->OUT - is there something simplistic in nature that u could introduce to the flow structure like:
IN->fan0->dev0->SOMETHING->fan1->dev1->SOMETHING->fan2->dev2->OUT
(a closed system with the exception of IN/OUT)
^^^^ this is the flow I`m looking to achieve. I don`t want to introduce any more IN/OUT of air.
Ideally I`m looking for SOMETHING to be something that air can flow over/through that with take minimal temps out of it.